The next-generation iPhone (a.k.a iPhone 6s) will feature a completely redesigned wireless system and take advantage of Qualcomm’s new LTE chip for better wireless performance, as revealed by some pictures of the internals of the handset received by 9to5Mac.
The iPhone 6s will make use of Qualcomm’s MDM9635M chipset — based on ‘Gobi’ platform — and will be capable of theoretically reaching a maximum download speed of 2x the iPhone 6 and iPhone 6 Plus.
This LTE chip is not new per se, since it is already being used in certain Android devices from last year. The MDM9635M chip is based on the 20nm fabrication process, which makes it denser, more power efficient and smaller than the existing LTE MDM9625M chipset used inside the iPhone 6 and iPhone 6 Plus. While this new chipset is capable of reaching download speeds of up to 300Mbps, the upload speeds are still limited to 50Mbps.
The source of 9to5Mac also reveals that the motherboard of the next-generation iPhones is narrower and more compact than the motherboard of iPhone 6 and iPhone 6 Plus, though not by much. The extra space freed up by the smaller motherboard would allow Apple to increase the battery capacity on the iPhone 6s and iPhone 6s Plus.
Previous leaks and reports about the iPhone 6s and iPhone 6s Plus have reported that thehandsets will come with Force Touch. Leaked images of the shell of the handsets from yesterday also revealed that they will look largely the same from outside, though there will be major changes to their internals.
[Via 9to5Mac]
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